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- Datacenter and AI Group, Sandra Rivera
- Intel 3rd Gen Xeon (Ice Lake); 1Mn+ shipped In 4Q21.
- Next Gen Xeon (Sapphire Rapids), Intel7 P-core, 2X performance vs NVDA A100 GPU.
- Intel 3 2024 Granite Rapids/ Sierra Forest P-core E-core, 感覺又是要底累的前哨戰
- Datacenter, mid-high single digit 2021-2023/ mid-teens 2023-2026.
- DCAI TAM$30B->$65B
- 上面表示沒有台積的東西
- Alchemist出貨2022要達4M
- 2H22要有一個Sapphire Rapids HBM, 搞不清楚為何又算在這部門, 以為都是GPU.
- 成長率最快的一個部門
- Intel 16(exitsting IFS)的rev長大緩慢, leading edge示意圖顯示謎之成長率.
- IFS新製程可提供服務的時間, 投影片上看來是跟自家新產品用的製程時程相同, 但預期到時會因良率不佳導致產能分配出狀況, 類似情形三星時常上演.
- Tower 0.5um-45nm, rev大概是聯電的1/4, 台積的1/40.
- Mobile eye反而沒給成長數字
- 第一張左圖奇怪的說詞for both IDM and IFS, 類似ubereats幽靈廚房多做一個生意的概念嗎? 2025開始IFS專用的產能.
- 中圖為何一直強調offset
- 右圖台積也是最近提高capital intensity
- Shell space可以折舊20年
- Smart Capital: 先建殼, 再依需求增加設備. modularly add capacity to the infrastructure; flexibly expanded with demand.
- Offest就是可以拿錢的, 一直強調資本支出不會花那麼多
- 第三張圖顯示2022-2026外包產能量會固定, 沒有增加
- 第四張圖中間, 2026產能+50% vs 2021
- FCF的討論
- FCF現在沒有到20%依然是付的, OPEX grow at lower rate, working capital討論的是庫存管理
- Investment grade似乎真的重要
- 真的是說EPS Accretive
- FCF 20% of revenue, 說是ROIC很高, 業內優秀比例.
- CCG主流產品, N3預計TSMC
- 所謂hybrid跟dis-aggregated差別在哪
- IFS客戶有Cisco
- AXG
- TSMC N7/ N6/ N5…
- Intel ARC Alchemist, 1Q NB, 2Q DT, 3Q workstation. 4M units 2022
- Sapphire Rapid HBM, 4X band width, sampling today, production 2H22
- EUV Intel 4開始做
- Intel 7 now in production, first product shipping in volume. 12th Gen Intel Core (Alder Lake)
- Intel 4
- Manufacturing ready H2 2022
- Meteor Lake/ Custom ASIC networking client
- First use of EUV
- 2022: Meteor Lake CPU tile production stepping tape out (H2)
- Intel 3
- Manufacturing ready H2 2023
- Future Xeon data center
- 2022: lead product test wafers running in fab (H2)
- Intel 20A
- Manufacturing ready H12024
- Future Product client
- Introduction of RibbonFET & PowerVia
- 2022: IP test wafers running in fab (H2)
- Intel 18A
- Manufacturing ready H2 2024
- Future Product Future Xeon Foundry Customer
- Data center client
- Up to 10% improvement in performance per watt
- Ribbon innovation for design optimization, line width reduction
- 2022: foundry customers' test chips (HI); first IP shuttle (H2)
- Sapphire Rapid EMIB
- Meteor Lake Foveros
source: Intel.com