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- Panel Driver
- HD Large size TFT LCD Driver IC (8"): 200-300nm
- FHD/ UHD Large size TFT LCD Driver IC (8"): 110-160nm
- UHD Large size TFT LCD Driver IC (12", high-end): 55-90nm
- Mobile TDDI Driver IC: 55-90nm
- HD TDDI Driver IC (smartphone): 55-110nm
- FHD TDDI Driver IC (smartphone): 40-55nm
- AMOLED Driver IC: 28-40nm
- OLED要最高級的製程
- Other 8" Logic
- Audio Codec IC: 110-300nm
- CIS: 110–280nm
- DDIC(Large Size): 110-300nm
- FoD (Fingerprint-on-display, 8" ) 180nm
- LED driver IC: 300–500nm
- MCU(Automotive): 150-300nm
- MOSFETs: 110-300nm
- NOR Flash: 100-180nm
- PMIC (8"): 110–280nm
- Retimer/redriver IC (Parade, Phison): 110-180nm
- T-cons (8" low-end): 110-180nm
- TPM ICs: 110–280nm
- USB Controller: 110-180nm, 250nm-500nm
- 最近市場PMIC需求激增, 相對排擠其他客戶產能. foundry廠考量價格與毛利跟客戶協調分配產能
- 價格來說MCU最高mosfet最低, DDIC居中, retimer/ redriver相對高價.
- 12" Logic customer
- NOR Flash (high density): 55–90nm
- T-cons(Parade, 12" high-end): 22–90nm
- LCD/ OLED DDIC (smartphone): 28-55nm
- CIS (Sony, GalaxyCore, Omnivison): 22nm, 55nm, 90nm, 110nm
- TPM IC: 40–60nm
- PMIC(12"): 55–90nm
- Retimer/redriver IC（Parade, Phison）: 110-180nm
- USB Controller (High-end): 28–90nm
- MCU: 40–90nm
- Memory controller IC: 28–40nm
- CPLD (Lattice): 22-28nm
- FPGA (Altera, Xilinx): 22-28nm and below
- BMC (server信驊): 28-60nm
- WiFi IC: 14-55nm
- CPU/ AP/ GPU: 14nm and below
- DDIC是12"最便宜的東西之一, 但是也是漲價漲翻天.
- 漲價的因素除了產能競爭之外, 考慮到客戶需求, 以及庫存, 似乎還是回到價格問題, 只能以價格彙整所有的前因後果.
- 還需多做考慮的是
- 產品什麼時候往下提高製程, 考量成本與效能, 有無新需求, 整合新功能
- 與其他製程的消長, 例如10nm在台積很快就消失, 卻沒有人細問, 而28nm卻很長壽.
- 文中提到CIS與TDDI製程強碰, foundry開心因為分散風險, 客戶擔心因為重疊到嗎.
- 還是有很多人是自己有fab(IDM), 製程選定的商業邏輯可能與foundry相異.
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